Thermoelectric cooler

摘要

A thermoelectric heat pump which is resistant against thermal stresses incurred during thermal cycling of Thermal Cyclers or the like between cold and hot temperatures of about 0 DEG C. at a ramping rate up to about 1 DEG C. per second has improved joints between the thermoelements and electrical conductors which have low electrical resistance and which substantially reduce fractures during thermal cycling. The joints include a tin-silver-indium solder containing by weight about 95% tin, 3.5% silver, and 1.5% indium, or a tin-silver-cadmium solder containing by weight about 95.5% tin, 3.5% silver, and 1.0% cadmium. A robust nickel diffusion barrier between the joints and thermoelectric elements ends provides additional improvement against joint fracture.