| 摘要 |
A soldering apparatus has a bellows chamber, formed by a bellows (4) and upper and lower closure pieces (6, 8) for containing molten solder (3). As the volume of the bellows chamber (2) is reduced, solder is expelled through a nozzle (52) and a solder ball (62) is formed. The volume of the solder ball (62) is monitored by an optical sensor (60). The volume of solder expelled from the bellows chamber (2) can be controlled precisely, and a joint to be soldered is brought down into contact with the solder ball (62). The space around the nozzle tip (36) is enclosed by heated nitrogen gas to reduce oxidation of the solder and help pre-heat the joint. A vibrator (32, 34) vibrates the nozzle tip (36) to assist the smooth growth of the solder ball (62). |
