发明名称 Semiconductor device with high dielectric capacitor having sidewall spacers
摘要 According to a semiconductor device and a method of manufacturing thereof, a sidewall spacer is formed at a sidewall of a contact hole, in a recess portion defined by the sidewall of the contact hole and a buried conductive layer, having a film thickness gradually increasing from a top face corner of an interlayer insulation film to the surface of the buried conductive layer. Therefore, a semiconductor device that can achieve favorable breakdown voltage and anti-leak characteristics between a lower electrode layer and an upper electrode layer forming a capacitor of a DRAM.
申请公布号 US5442213(A) 申请公布日期 1995.08.15
申请号 US19940255854 申请日期 1994.06.07
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OKUDAIRA, TOMONORI;KUROIWA, TAKEHARU;FUJIWARA, NOBUO;KASHIHARA, KEIICHIRO
分类号 H01L21/28;H01L21/02;H01L21/3205;H01L21/768;H01L21/822;H01L21/8242;H01L21/8246;H01L23/522;H01L27/04;H01L27/105;(IPC1-7):G11C11/24 主分类号 H01L21/28
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