发明名称 POWER MODULE
摘要 PURPOSE:To provide a power module, wherein the prevention of the erroneous operation in a drive control circuit and the maintenance of excellent heat radiating property can be made compatible, and which can readily obtain the compact configuration and the cost reduction. CONSTITUTION:A metal substrate 1 having a first insulating layer 2 on one surface, a second metal substrate 3 arranged on a part of the exposed surface of the insulating layer 2, an insulating layer 4 arranged on the exposed surface of the metal substrate 3 and a wire 20, which keeps the metal substrate 3 at the grounding potential, are provided. A power switching element group 6 is arranged on the exposed surface of the insulating layer 2. A pre-driver IC 8 is arranged on the exposed surface of the insulating later 4. The switching noise from the power switching element group 6 is shielded with the metal substrate 3 kept at the grounding potential. Therefore, the erroneous operation of the control circuit can be prevented. The power switching element group 6 is arranged on the heat radiating metal substrate 1 only through the insulating layer 2. Therefore, the heat radiating effect can be sufficiently enhanced.
申请公布号 JPH07211857(A) 申请公布日期 1995.08.11
申请号 JP19940005221 申请日期 1994.01.21
申请人 HITACHI LTD;HITACHI HARAMACHI SEMICONDUCTOR LTD 发明人 IMAMICHI YOSHITAKA;MATSUZAKI HITOSHI;MIURA MASAHITO
分类号 H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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