TREATING METHOD OF CIRCUIT BOARD

摘要

PURPOSE:To enhance an inner circuit board used for manufacturing a multilayered printed board and insulating adhesive resin in adhesion between them so as to improve the printed board in resistance to soldering heat. CONSTITUTION:The surface of a copper circuit provided onto a circuit board is subjected to an oxidizing treatment. Then, the surface of the copper circuit is treated with coupling agent, and the coupling agent is baked on the surface of the copper circuit at temperatures higher than 155 deg.C. The copper circuit and prepreg insulating adhesive resin are enhanced in adhesive properties between them through an anchoring effect obtained by roughening the surface of the copper circuit and a coupling effect obtained by coupling agent. Furthermore, a coupling agent film deposited on the surface of the copper wiring can be enhanced in strength, and an increase in adhesion between the copper circuit and prepreg insulating adhesive resin by coupling agent can be promoted by baking carried out at temperatures higher than 155 deg.C.