| 摘要 |
PURPOSE:To enhance film thickness controllability and operation environment and to facilitate pattern formation by forming a resist polyurea film on the surface of a substrate by the vapor deposition polymerization process. CONSTITUTION:The pattern forming device comprises a vapor deposition chamber 1 for forming the photosensitive polyurea film, an exposure chamber 2 for irradiating the polyura film with ultraviolet rays to expose it,-and a developing chamber 3 for subjecting the irradiated film to heat treatment, and these chambers l, 2, and 3 are connected through valves 4 in this order. Starting monomers for forming the photosensitive resin are evaporated in vacuum and deposited on the surface of the substrate 11 and polymerized to form the polyurea film. This film is irradiated with the ultraviolet rays to cause a cross- linking reaction and to form an indecomposable polyurea, the film is then subjected to heat treatment to depolymerize the polyurea on the nonirradiated parts to evaporate them off. |
