SURFACE-CHARACTERISTIC DETERMINATION METHOD OF MOUNTING FILM

摘要

PURPOSE: To precisely measure the flatness of the surface of a mounting film. CONSTITUTION: A thin and highly plane-paralleled reflective test wafer 16 is stuck to a non-reflective surface of a mounting film 14 to make the surface reflective. The test wafer 16 generally has a narrower thickness than that of a final product wafer and is stuck by direct pressure to the object mounting film 14 to be measured and formed into a shape reflecting the outer shape of the surface of the film. The test wafer 16 keeps the shape reflecting the outer shape of the surface of the film for a long duration and the profile of the mounting film 14 can be easily measured and graphically drawn by a computer-built-in interferometer by a known technique and the measured values can be numerically recorded. When the measurement is completed and the parameters of the mounting film surface are determined, the test wafer 16 is taken out to be used repeatedly and the film is utilized the wafer treatment in a conventional manner.