| 摘要 |
PURPOSE:To provide a lead frame which can be easily connected with the electrode of a semiconductor element via the bump of an inner lead, and a manufacturing method of the lead frame which can very easily form the bump. CONSTITUTION:On a region 5 of a metal substrate 1 where the inner lead 6 is to be formed, a metal layer 2 for a bump is formed, and on the metal layer, an inner lead is formed. By using the inner lead as a mask and etching the metal layer 2, the bump 2 is formed, and then an outer lead is formed by selectively etching the metal substrate 1 from the rear side. |
