| 摘要 |
PURPOSE:To rigidly solder and bond insulator composed of aluminum oxide based sindered body to a metal radiator having high thermal conductivity without generating large distortion, effectively dissipate the heat generated at the time of operating a semiconductor element toward the outside, and normally and stably operate the semiconductor element for a long term. CONSTITUTION:The package is constituted by soldering a radiator 1 to insulator 2 which is composed of aluminum oxide based sintered body and has a space for accommodating a semiconductor element in the inside. The metal radiator 1 is formed by soldering copper plates 5, 6 on the surface and the rear of a molybdenum plate 4. When the thickness of the molybdenum plate 4 is T1, the thickness of the copper plates 5, 6 is T2, T2/T1 is 1.25-4. |
