| 摘要 |
PURPOSE:To position an LED array chip closely to a photosensitive film even when the chip is incorporated in a camera. CONSTITUTION:An LED array chip 10 partially mounted on the surface 9 of a wiring board 8 has a wire-bonded surface 11 which is parallel with the surface 9 of the substrate 8 and a light emitting surface 12 which is nearly perpendicular to the surface 11. A resin film 14 which integrally covers the surface 11 and connecting wires 13 extended to the substrate 8 from the surface 11 is provided on the substrate 8 except the light emitting surface 12 (or, thinly on the light emitting surface 12). |
