| 摘要 |
PURPOSE:To exchange other laser emission object of laser emission objects to improve the throughput of a laser application device without reducing the safety of an operator to a laser by a method wherein the device is provided with two third regions A, which respectively have one of first door means, which are opened and shut between the regions A and a first region B, and one of second door means which are opened and shut between the regions A and a second region C. CONSTITUTION:Regions A, in which each wafer cassette 7 is once housed and which respectively have one of shutter mechanisms 22, which are opened and shut between the regions A and a region B, and one of wafer cassette exchange doors 19, which are opened and shut between the regions A and a region C, are provided between the region B, on which a laser main body 1 is arranged and which is light-shielded from the periphery by a cover 2, and the region C, which is secured the safety to a laser beam outside of the region B. Thereby, even while the wafer cassette 7a on one side of the wafer cassettes 7a and 7b is subjected to treatment by the laser main body 1, the safety of an operator to a laser is never reduced and the other wafer cassette 7b arranged on the other region A of the regions A can be exchanged. In this way, the throughput of a laser application device can be remarkedly improved. |
