发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 <p>PURPOSE: To provide a semiconductor device, together with its manufacturing method, comprising a new gate electrode structure. CONSTITUTION: A gate electrode comprises a metal layer 206 which is enclosed with such diffusion-preventing material layer 205 as titanium nitride(TiN). Since diffusion or precipitation of metal on an underlying layer is prevented by the diffusion-preventing material layer 205, a copper of low resistance can be used as the metal layer 206. By consisting a gate electrode with the metal layer 206 of heat-resistant metal which, being of low resistance, is enclosed with the diffusion-preventing material layer 205, a time delay due to high resistance of a gate electrode is shortened, and power consumption is reduced.</p>
申请公布号 JPH07211904(A) 申请公布日期 1995.08.11
申请号 JP19940312053 申请日期 1994.12.15
申请人 SAMSUNG ELECTRON CO LTD 发明人 SHIN GENKOKU;BOKU KEISAN;BUN SHIYOU;CHIN YASUHIKO
分类号 H01L21/28;H01L21/3205;H01L21/336;H01L23/52;H01L29/78;(IPC1-7):H01L29/78;H01L21/320 主分类号 H01L21/28
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