FABRICATION OF SEMICONDUCTOR ELEMENT

摘要

PURPOSE:To provide a method for preventing the clogging caused by PHS of dicing blade when a dicing saw is used or effecting the separation without using the dicing saw. CONSTITUTION:A semiconductor 11 is stuck to a support 13 on the side for forming semiconductor elements and then the substrate 11 is abraded thin. The separating part between a via hole forming part and a semiconductor element is then removed from the thin substrate 11 thus obtaining a via hole 17 and a hole part 19. Subsequently, a current film 21 for plating and a polyimide reinforcing film 23 are formed. The reinforcing film 23 is removed selectively such that the film 23 is left on the hole part 19 but removed from the part for forming a thin heat dissipation film. The thin heat dissipation film (e.q. an Au film) is then formed on the current film exposed by selective removing. The reinforcing film and the current film in the hole part 19 are then subjected to dicing.