| 摘要 |
PURPOSE:To provide a resin sealing metal mold, wherein a sealing resin, which flows in an air vent, does never block the air vent. CONSTITUTION:A fluorine resin (a non-adhesive member) 9, whose adhesive force to a sealing resin 5 is weaker than that of the resin 5 to a lead frame 4, is buried in an air event 8 in a resin sealing metal mold 1, wherein a semiconductor chip 2, which is mounted and bonded on the frame 4, is sealed by molding with the resin 5. Thereby, as the resin 5, which flows in the vent 8, results in adhering to the side of the frame 4, the vent 8 is never blocked and the shortage of a molding and the generation of bulk voids are prevented. |
