| 摘要 |
PURPOSE:To make it possible to select two elements without needing a high-cost evaluation device in a bump bonding of the two elements and to improve the yield of the manufacture of a semiconductor device by the recovery of the non-defective element of the two elements. CONSTITUTION:When two elements 1 and 2 are subjected to bump bonding by a flip chip bonding, a bump bonding pressure control layer 3, which is formed in a thickness smaller than the height of bumps prior to the bonding and larger than the height of the bumps subsequent to the bonding and has a hardness higher than that of the bumps, is provided on either of the two elements or both of the two elements, the two elements are pressed until one or both of the two elements comes or come into contact to the control layer to make a check on the characteristics of the element and the good is sorted from the bad of the whole elements. In the case where the characteristics of the whole elements are defective, the two elements are separated from each other to recover the non-defective element of the two elements and in the case where the characteristics of the whole elements are non-defective, the two elements are repressed to strengthen the bonding force of the bumps.
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