| 摘要 |
PURPOSE:To closely arrange three kinds of semiconductor chips for obtaining white light without deteriorating their mechanical strengths. CONSTITUTION:A plurality of LED elements 9, 15, and 20 emitting different colors of light are bundled so that their resin sealing sections 14, 19, and 24 respectively covering semiconductor chips 11, 16, and 21 and one end sections of lead wires 10 and 13, 17 and 18, and 22 and 23 can come into contact with each other. The bundled sections 14, 19, and 24 are united in one body with a light-transmissive surface resin layer covering the sections 14, 19, and 24. |
