| 摘要 |
PURPOSE:To reduce the number of processes of adhering wafer to surface plate and avoid damage of wiring surface when adhering, by placing a fiber material sheet soaked with thermoplastic adhesive when mounting a semiconductor wafer onto a lapping surface plate, and lapping the wafer after heating and pressing. CONSTITUTION:An adhesion sheet 7 having callulose soaked with thermoplastic adhesive is placed on the adhesion surface of a lapping surface plate 4, and a semiconductor wafer 1 having electrode is mounted thereon with the electrode surface dewnward, being in close contact with the sheet 7. Then pressure is applied by using a heated spindle 8. Then pressure is applied by using a heated spindle 8. Thus, the adhesive contained in the sheet 7 melts out from the wafer 1 side and the surface plate 4 side, so that the wafer 1 is bonded with the surface plate 4 by way of the sheet 7. Removing the spindle 8, the melted adhesive 9 is cooled together with the wafer 1 and the surface plate 4, so that the adhesion of the wafer 1 and the surface plate is reinforced. |
