PACKAGED INTEGRATED CIRCUIT AND MANUFACTURE THEREOF

摘要

PURPOSE: To provide an integrated circuit package, together with its manufacturing method, with a path of high thermal conductivity. CONSTITUTION: An integrated circuit package 8 is formed on a substrate 14 comprising an opening which is formed to receive a thermally conductive slug 12. An integrated circuit chip 10 is mounted to one side of the slug 12, and the opposing surface of the slug 12 is exposed to the lower side of substrate 14. The chip 10 is wire-bonded to the substrate 14 for encapsulating in the conventional manner. On the lower side of substrate 14 and slug 12, a solder ball 18 for attaching to a circuit board 20 is mounted. When it is mounted to the circuit board 20, a path of high thermal conductivity is provided between the chip 10 and the circuit board 20 through the slug 12 and the solder balls 18.