Photo varnish film development method for semiconductor mfr.

摘要

The method involves applying a varnish solution (19) to an uneven surface of a wafer (11) to give a coating with a smooth surface. The wafer is then inverted on a lathe to bring the smooth varnish side downwards and is then rotated at high speed. A photo varnish film formed has an uneven surface along the topology of the wafer but has a film thickness constant at all points.