| 摘要 |
A semiconductor chip module comprises a substrate (1) on which a wiring portion (2) is formed, a semiconductor chip (6) mounted on the wiring portion (2) so as to face the circuit side thereof down to the wiring portion (2), a heat sink (3) having one end portion contacting the side opposite to the circuit surface of the semiconductor chip (6), and a cap (4) enclosing the semiconductor chip (6) and having an opening (4) for exposing externally the other end portion of the heat sink (3). |
