| 摘要 |
<p>A micromechanical tuning fork gyroscope (14) fabricated by a dissolved silic on wafer process whereby eletrostatic bonding forms a hermotic seal between an etched glass substrate (12), metal electrodes (20 2) deposited thereon, and a silicon comb-drive tuning fo rk gyroscope (14). The dissolved silicon wafer process involves single-sided pr ocessing of a silicon substrate (1001, including the ste ps of etching recesses (102), diffusing an etch resistant dopant (104) into the si licon substrate (1003, and releasing various components of the silicon gyroscope (14) by etching through the diffusion layer (104) in desir ed locations (106). The glass substrate (12) also underg oes single-sided processing, including the steps of etching recesses, depositing a multi-metal system in the recesses (200), and selecti vely etching portions of the multi-metal system (202). One substrate (100) is inverted ov er the other (12) and aligned before anodic bonding of t he two substrates is performed.</p> |
