Semiconductor device package forming process

摘要

The process involves using a first connecting wire frame (1) to support a carrier plate (10) by a number of support wires (11). A second connecting wire frame (2) overlaps the first, and is connected by support wires (21,25). The first and second wire frames (1, 2) are arranged in an injection mould within a cage, together with the inner connecting wire sections (22, 26) of the inner connecting wires (21, 25). Offset sections (12) lay outside the cage. A second mould is clamped to the first, and a resin case is formed around the device.