| 摘要 |
A sputter deposition system (10) includes a mobile collimator (20). The collimator can be magnetically moved into and out of a position between a wafer (28) and a target of material (26) to be sputtered onto the wafer. In addition, magnets (36, 38) are used to levitate the collimator so that it can be removed without solid-solid friction and the contamination it can cause. The magnets used for levitation are part of a control loop that maintains the orientation of the collimator parallel to the wafer. The system alllows for a combination of good deposition step coverage and high fabrication throughput while minimizing opportunities for contamination and breakage that can occur when the wafer is transferred between chambers (12).
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