发明名称 PRINTED WIRING BOARD AND MULTI-WIRE WIRING BOARD
摘要 PURPOSE:To remarkably lessen a wiring board in interference and external static induction noises by a method wherein a circuit pattern that includes signal lines is surrounded with insulating resin or the like and then surround again with a plane pattern of conductive resin connected to a power supply wire and a ground wire into a pseudo-coaxial structure. CONSTITUTION:A multilayer printed wiring board 30 is of pseudo-coaxial structure, wherein a signal wire is arranged inside the board 30, and a planar conductive pattern is formed on the surface of the board 30 surrounding both the sides of the signal wire. A multi-wire wiring board is of coaxial structure that surrounds an insulating coated wire. Therefore, signal wires and insulating coated wires are lessened in impedance so as to prevent the signal wires from interfering with each other due to electromagnetic induction. The surface of the board is covered with a planer pattern of a power supply wire and a ground wire to shield the adjacent signal wires, so that the planar pattern 32 is made to function as an electrostatic shield, and the wiring board can be remarkably lessened in external electrostatic induction noise.
申请公布号 JPH07212043(A) 申请公布日期 1995.08.11
申请号 JP19940004507 申请日期 1994.01.20
申请人 HITACHI CABLE LTD 发明人 GUNJI OSAMU
分类号 H05K9/00;H05K1/00;H05K1/02;H05K3/10;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K9/00
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