| 摘要 |
An IC package receptacle is disclosed in which, as an actuator is pushed down, a pushing surface thereof pushes down pressure bearing portions of a plurality of contacts against an elastic force to bring the contacts into and out of contact with leads of an IC package. To cope with an increase of the number of contact poles, the pushing load is reduced by providing a plurality of pushing load peaks brought about by different pushing surfaces. The contacts are grouped into a plurality of unit groups of contacts. The individual groups of contacts are pushed by the different pushing surfaces, respectively, thus providing a deviation between pushing load peaks and provided by the pushing surfaces on the respective unit groups of contacts. |
