摘要 |
The disclosure describes a method of forming a groove in a structure of a semiconductor laser diode, which comprises a crystal growth procedure of epitaxial growth of a core layer comprising MP, wherein M represents one or more of elements belonging to group IIIb of periodic table and an upper layer comprising MAs, wherein M represents one or more of elements belonging to group IIIb of periodic table, successively on (100) surface of MAs crystals in a lower layer comprising MAs; a photolithography and wet etching procedure of, after forming an etching mask on the upper layer, forming an etching window to the etching mask; a first etching procedure of selective etching the upper layer; and a second etching procedure of selective etching other faces except for the face in which (111) face of MP crystals in the core layer is exposed. <IMAGE> |
申请人 |
MITSUBISHI CHEMICAL CORPORATION |
发明人 |
HORIE, HIDEYOSHI, C/O MITSUBISHI CHEMICAL CORP.;FUJIMORI, TOSHINARI, C/O MITSUBISHI CHEMICAL CORP.;NAGAO, SATORU, C/O MITSUBISHI CHEMICAL CORP.;HOSOI, NOBUYUKI, C/O MITSUBISHI CHEMICAL CORP.;GOTO, HIDEKI, C/O MITSUBISHI CHEMICAL CORP. |