发明名称 Method of forming a groove in a semiconductor laser diode and a semiconductor laser diode.
摘要 The disclosure describes a method of forming a groove in a structure of a semiconductor laser diode, which comprises a crystal growth procedure of epitaxial growth of a core layer comprising MP, wherein M represents one or more of elements belonging to group IIIb of periodic table and an upper layer comprising MAs, wherein M represents one or more of elements belonging to group IIIb of periodic table, successively on (100) surface of MAs crystals in a lower layer comprising MAs; a photolithography and wet etching procedure of, after forming an etching mask on the upper layer, forming an etching window to the etching mask; a first etching procedure of selective etching the upper layer; and a second etching procedure of selective etching other faces except for the face in which (111) face of MP crystals in the core layer is exposed. <IMAGE>
申请公布号 EP0666625(A1) 申请公布日期 1995.08.09
申请号 EP19950300557 申请日期 1995.01.30
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 HORIE, HIDEYOSHI, C/O MITSUBISHI CHEMICAL CORP.;FUJIMORI, TOSHINARI, C/O MITSUBISHI CHEMICAL CORP.;NAGAO, SATORU, C/O MITSUBISHI CHEMICAL CORP.;HOSOI, NOBUYUKI, C/O MITSUBISHI CHEMICAL CORP.;GOTO, HIDEKI, C/O MITSUBISHI CHEMICAL CORP.
分类号 H01L33/00;H01S5/20;H01S5/22;H01S5/223;H01S5/227 主分类号 H01L33/00
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