发明名称 Method for manufacturing a bipolar transistor for the protection of an integrated circuit against electrostatic discharges.
摘要 <p>Prodn. of a bipolar transistor, for protection against electrostatic discharges in an IC, involves masking operations to delimit, for the transistor in a semiconductor substrate, two implantation zones sepd. by a sepn. zone, followed by selectively doping the implantation zones by impurity implantation. In one process, the novelty comprises (a) masking to form field oxide around an active zone including the implantation zones; (b) masking to separate the different implantation zones within the active zone; and (c), after implantation, covering part of the implantation zones and of the sepn. zone with insulation deposited on the semiconductor substrate at the location of the sepn. zone. In a second process, the novelty comprises (a) forming, during the masking operations, a field oxide which does not cover the implantation zones and the sepn. zone; and (b) temporarily masking the sepn. zone during implantation so that only the implantation zones are doped. Also claimed is a bipolar transistor for protection against electrostatic discharges in an IC.</p>
申请公布号 EP0666597(A1) 申请公布日期 1995.08.09
申请号 EP19950470003 申请日期 1995.01.23
申请人 SGS-THOMSON MICROELECTRONICS S.A. 发明人 TAILLIET, FRANCOIS , CABINET BALLOT SCHMIT
分类号 H01L27/02;H01L29/73;H01L21/331;H01L21/822;H01L27/04;H01L29/732;(IPC1-7):H01L27/02 主分类号 H01L27/02
代理机构 代理人
主权项
地址