A method of making a Flip Chip Solder bond structure for devices with gold based metallisation.

摘要

A flip-chip solder bonding arrangement including a semiconductor substrate (40) having thereon layers of metallisation (42, 44, 46) which have a tendency to interact with a solder material, forming on said layers of metallisation (42, 44, 46) a barrier metallisation layer (44) which is not reactive with said solder material, forming solder pads (46) on the barrier layer (44) and thereafter forming solder bonds (48) with such solder pads (46) employing said solder material.