发明名称 Method of manufacturing electronic components.
摘要 Disclosed herein is a method of efficiently forming external electrodes on chip electronic components such as multilayer ceramic capacitors in desired thicknesses. Cutting grooves (5) are formed in a block (1) along surfaces (3, 4) to be provided with external electrodes for dividing the block (1) into individual chips (6) while metal paste (7) for forming external electrodes is cast into the cutting grooves (5) and dried, so that the metal paste (7) filling up each of the cutting grooves (5) is cut with a blade (8) to be divided in two. Parts of the metal paste (7) thus being divided with the blade (8) define external electrodes. <IMAGE>
申请公布号 EP0535995(B1) 申请公布日期 1995.08.09
申请号 EP19920309050 申请日期 1992.10.05
申请人 MURATA MANUFACTURING CO., LTD. 发明人 INAGAKI, YASUTO, C/O MURATA MANUFACTURING CO.,LTD.;KOHNO, YOSHIAKI, C/O MURATA MANUFACTURING CO.,LTD.
分类号 H01C17/28;H01G4/232;H01G4/248;H01G4/30;H01G13/00;(IPC1-7):H01G4/30 主分类号 H01C17/28
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