| 发明名称 |
Solder powder coated with parylene. |
| 摘要 |
<p>Solder powders coated with a thin layer of parylene and solder pastes containing the coated solder powders are disclosed. The coated solder powders can exhibit a high degree of resistance to oxidation and to reaction with the flux contained in the solder paste without substantially interfering with the reflow characteristics of the solder.</p> |
| 申请公布号 |
EP0556864(B1) |
申请公布日期 |
1995.08.09 |
| 申请号 |
EP19930102754 |
申请日期 |
1993.02.22 |
| 申请人 |
LONDON CHEMICAL COMPANY, INC. |
发明人 |
JENKINSON, RICHARD DAY;SOWA, MICHAEL WILLIAM |
| 分类号 |
B23K35/22;B23K35/02;B23K35/14;B23K35/36;B23K35/363;B23K35/40;H05K3/34;(IPC1-7):B23K35/14 |
主分类号 |
B23K35/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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