发明名称 |
Encapsulation techniques which include forming a thin glass layer onto a polymer layer |
摘要 |
An encapsulant comprised of alternate layers of polymer and glass gives enhanced protection to semiconductor integrated circuit devices, which is much more effective than either glass or polymer encapsulations by themselves. In one embodiment, a semiconductor device (11) is covered by a polymer layer (13), the polymer layer being covered by a glass layer (14), and the glass layer being covered by a second polymer layer (15). The glass is preferably deposited by a plasma enhanced chemical vapor deposition apparatus (17 of FIG. 2 ). |
申请公布号 |
US5439849(A) |
申请公布日期 |
1995.08.08 |
申请号 |
US19940191378 |
申请日期 |
1994.02.02 |
申请人 |
AT&T CORP. |
发明人 |
MCBRIDE, RICHARD;WONG, CHING-PING |
分类号 |
H01L23/29;H01L23/31;(IPC1-7):H01L21/56 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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