| 摘要 |
<p>PURPOSE:To obtain a resin compsn. for a solder resist ink which is developable with a dil. aq. alkali soln. and excellent in resistances to soldering heat and gold plating by compounding a resin curable with an active energy ray, a photopolymn. initiator, a diluent, and a polyglycidyl ether. CONSTITUTION:This compsn. contains a resin curable with an active energy ray and obtd. by reacting an epoxy vinyl ester resin with a polybasic acid anhydride, a photopolymn. initiator, a diluent, and a polyglycidyl ether of a compd. linked to an arom. hydroxyl compd. through an alicyclic hydrocarbon group. A resist film is formed by applying the compsn. to a printed circuit substrate by screen printing, electrostatic coating, etc., drying the applied compsn., irradiating the resulting photopolymerizable film with an active energy ray, removing unexposed parts with a dil. aq. alkali soln. to form a resist pattern, and thermally post-curing the pattern.</p> |
