| 摘要 |
PCT No. PCT/JP91/01195 Sec. 371 Date Jun. 29, 1992 Sec. 102(e) Date Jun. 29, 1992 PCT Filed Sep. 9, 1991 PCT Pub. No. WO92/04730 PCT Pub. Date Mar. 19, 1992.A semiconductor device employs a lead frame including a die pad (24) and a plurality of leads (25) provided outside the die pad, and is manufactured by sealing the die pad and its periphery by a resin after the die pad is fitted with the semiconductor chip (11). The die pad (24) is formed separately from the main part of the lead frame provided with leads, and is rounded at an entire outermost edge thereof and includes a flat plate shape. This die pad can be either formed rounded with ceramic or resin, or formed in metal and given a rounded edge through honing.
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