发明名称 |
SEMICONDUCTOR AND MANUFACTURE METHOD |
摘要 |
The semiconductor package is to enhance adhesion characteristic by getting rid of expansion force due to the thermal change of a semiconductor tape. The method consists of the steps of; forming polyester organic compound with a TAB tape in order to eliminate expansion force due to the thermal change of the tape, forming Cu pattern, and forming a circular or rectangular hole on the tape.
|
申请公布号 |
KR950008849(B1) |
申请公布日期 |
1995.08.08 |
申请号 |
KR19920011097 |
申请日期 |
1992.06.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YUN, JIN - HYON;YUN, JONG - SANG |
分类号 |
H01L21/60;H01L23/02;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|