PROCESS FOR MANUFACTURING A MULTI-LAYER LEAD FRAME

摘要

A process for manufacturing a multi-layer lead frame for a semiconductor device comprising at least two metal components (12,20,32) adhered to one another via an insulation tape piece (42). The metal components (12,20,32) and the insulation tape pieces (42) are all surrounded by supporting frames (14,24,36,46) including positioning means (16,28,39,48) such as holes to ensure that they are aligned correctly. Then the insulation strip (40) is punched to cut the insulation piece (42), which is preliminarily adhered to one metal component strip (10,18,30). The metal strip (10,18,30) is then punched to cut and remove the metal component (12,20,32) which is then laminated and heat-pressed to another metal strip (10,18,30). After it is completely adhered, the other metal strip (10,18,30) is punched to remove the multi-layer lead frame assembly or sub-assembly.