| 摘要 |
PURPOSE:To obtain a high quality small circuit structure by integrally molding a plurality of electronic devices of a thermoplastic resin while exposing the electrode of each device on the same plane thereby eliminating the need of circuit board. CONSTITUTION:Integrated circuit devices, chip resistors and other electronic devices 5 necessary for constituting a circuit are integrally molded of a thermoplastic resin 6, e.g. a liquid crystal polymer, with the electrode 7 of each device 5 being exposed on a same plane. The circuit structure is provided integrally, on one side thereof, with connectors 8 for connecting a part of wiring 9 of each device 5, the circuit structure is reduced in size because it requires no circuit board and contributes to reduce the size of the electronic device. Furthermore, since each device 5 is bonded firmly through the thermoplastic resin while establishing the electrical connection, wiring and connection with other objects are facilitated while enhancing the quality. |
