| 摘要 |
<p>PURPOSE:To provide a method of manufacturing chip-type ceramic devices which are less dispersed in chip size and electrical properties, wherein an internal electrode and an insulating inorganic layer are easily and quickly formed. CONSTITUTION:An internal electrode 23 is formed on both the sides of a conductive ceramic sintered sheet, and the sintered sheet provided with maternal electrodes 23 is cut into chip-shaped ceramic elements 22. The ceramic element provided with the internal electrodes is fully coated with an insulating inorganic layer 24 as thick as 2 to 10mum, and conductive paste 25 which includes metal powder and inorganic binder is applied onto both the end faces of the ceramic element provided with internal electrodes. The ceramic element is burned at temperatures lower than the melting point or softening point of the inorganic layer 24, and inorganic binder contained in the applied paste 25 is fused together with a part of the lower inorganic layer 24 by reaction, whereby a part of the inorganic layer 24 is made to disappear, and external electrodes 26 are formed. Plating layers 27 and 28 are formed on the surfaces of the external electrodes 26.</p> |
