SEMICONDUCTOR DEVICE AND ITS MANUFACTURING DEVICE

摘要

PURPOSE:To provide a semiconductor device which can increase as much as possible the size of a semiconductor chip in a package of preset outer dimensions. CONSTITUTION:There is a height difference between a first parting surface 19 of a lead terminal 4 of a package for a semiconductor chip and a second parting surface 18 of a die pad lifting lead 7 supporting the die pad. A parting line 20 connecting the first parting surface 19 to the second parting surface 18 is provided where a lead terminal does not protrude on the side of the package other than corner ridge lines.