METHOD FOR PLATING ELECTRONIC PARTS AND PLATING JIG,申请号JP19940003828-传众专利搜索

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发明名称	METHOD FOR PLATING ELECTRONIC PARTS AND PLATING JIG
摘要
申请公布号	JPH07207497(A)	申请公布日期	1995.08.08
申请号	JP19940003828	申请日期	1994.01.19
申请人	SONY CORP	发明人	AKAGI KAZUTO
分类号	C25D7/00;C25D17/08;(IPC1-7):C25D17/08	主分类号	C25D7/00
代理机构		代理人
主权项
地址

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