| 摘要 |
PURPOSE:To enhance adhesion between a conductor circuit and resin while preventing the pickling phenomenon around a photo via hole in a PWB employing a build-up method. CONSTITUTION:The method for producing a printed wiring board comprises a step for dyeing a conductor pattern 1 black, a step for coating a substrate 2 dyed black with a photosensitive resin insulating layer 5, a step for exposing the resin insulating layer 5 through a mask and developing to form an insulating layer pattern, a step for roughening the resin insulating layer 5 with a mixed aqueous solution of chromic acid and sulfuric acid, a step for reducing the substrate, and a step for plating the substrate. |
