| 摘要 |
<p>PURPOSE: To provide a lead frame assembly, whereby a plurality of chips are integrated easily into a single enclosure. CONSTITUTION: A lead frame assembly has a bottom wall 14, first side walls 16 extending upward from the ends of the bottom wall 14, a first base member 12 with the shape of a recessed portion for mounting semiconductor chips 52 thereon which is disposed on the upper ends of the bottom wall 14 and has first flanges 18, extending from the upper ends outward in its side surface directions, a plurality of conductive paths 26 disposed on the upper surface of the bottom wall 14 which extend upward along the inner surfaces of the side walls 16 to reach the flanges 18, and a lead frame 40 comprising a plurality of cantilever-like leads which extend from the upper ends of the frame 40, coupled to the conductive paths 26 on the flanges 18.</p> |
