| 摘要 |
<p>PURPOSE:To eliminate the poor bonding caused by the burrs generated when a film is punched by improving the glueability of a film and to decrease warped lead frames after adhesion of film. CONSTITUTION:A binder-applied polyimide film 7, on which polyetheramide- imide is applied to both sides, is fed to the prescribed place on a punching mold. The film 7 is punched into the prescribed shape, and they are sucked by a collet 23. A film 8 is carried to a solvent vessel 25, and the bonding agent is swellingly dissolved by bringing the surface to be adhered into contact with the solvent 24. At this time, the burrs generated when punching are dissolved and removed. The film 8 is conveyed to the prescribed position on a lead frame 19, and it is pressed thereto. Then, the film is carried to a point between heat blocks 5, dried up at 100 deg.C or thereabout, and its adhesion is completed. As the film is dried up at the low temperature of 100 deg.C, the warpage, due to the diffusion in linear expansion coefficient when the film returns to the normal temperature, is not generated on the lead frame.</p> |
