| 摘要 |
PURPOSE:To provide a semiconductor device of high level of integration wherein an arbitrary number of neighboring subchips can be constituted in one chip. CONSTITUTION:Four subchips 1, 2, 3, 4 which are adjacent on a wafer are made one chip. Adjacency detection circuits D1, D2, D3, D4 which detect whether neighboring subchips exist are arranged at the four cardinal portions of each of the subchips. The output signals S1, S2, S3, S4 of the adjacency detection circuits D, D2, D3, D4 are inputted in a decoder DEC. Thereby the decoder DEC recognizes the position of each of the subchips when the subchips are constituted in one chip. |
