| 摘要 |
PURPOSE:To obtain a method for both sided lapping suitable for mass-production of small warpage by adapting a single sided lapping technique for both sided lapping. CONSTITUTION:If there are no relative movements, an abrasive develops no rolling nor lapping. For that purpose, firstly the direction of rotation of an upper surface plate 1 is made different from the direction of revolution of a carrier 4 to lap only one side of a wafer 3 on the upper surface plate 1 side. Meanwhile, the number and the direction of rotation of the lower surface plate 2 are equalized with those of revolution of the carrier 4 so that the opposite side of the wafer 3 on the lower side plate 2 side may not be lapped. After one side of the wafer 3 is lapped, its relation is reversed, that is, the direction of rotation of the lower surface plate 2 is made different from the direction of revolution of the carrier 4 to lap only the opposite side of the wafer 3 on the lower surface plate 2 side. Meanwhile, the number and the direction of the upper surface plate 1 are equalized with those of revolution of the carrier 4 so that one side of a lapped wafer may not be lapped. |
