发明名称 HEAT-TREATING DEVICE
摘要 PURPOSE:To obtain a device provided with a structure that an airtightness in a coupled part can be ensured, by a method wherein at least one closer to a heat source out of the counter plane parts of the coupled part formed by making the counter plane parts pressure-weld to each other is formed into a constitution, wherein the passage of infrared rays is stopped. CONSTITUTION:In a heat-treating device of a structure that counter plane parts are made to pressure weld to each other to seal a coupled part formed by the pressure- welding and process gas is fed to heat-treat, at least one closer to a heat source out of the opposed plane parts is formed into a constitution, wherein the passage of infrared rays is stopped. For example, flanges 110A and 112A, which are made to project to the outside and are constituted integrally with quartz tubes 100 and 112, are respectively provided on the respective opposed end parts of the tubes 100 add 112 and a sealing member 114 is arranged between the opposed surfaces of the flanges 110A and 112A. At least the flange 110A closer to a heat source out of the flanges 110A and 112A is constituted of opaque quartz. The opaque formation of such the tubes 100 and 112 is obtained by making bubbles mix in the end parts, for example, of the tubes 100 and 112 when the flanges 110A and 112A are formed on the end parts.
申请公布号 JPH07201769(A) 申请公布日期 1995.08.04
申请号 JP19930352856 申请日期 1993.12.29
申请人 TOKYO ELECTRON LTD;TOKYO ELECTRON TOHOKU LTD 发明人 SAITOU YUKIMASA
分类号 H01L21/22;H01L21/31;(IPC1-7):H01L21/22 主分类号 H01L21/22
代理机构 代理人
主权项
地址