| 摘要 |
PURPOSE:To improve assembly and handling and increase reliability of connection with a printed board and the like. CONSTITUTION:A film carrier with a copper foil pattern formed in the surface of a polyimide film 1 does not have a device hole and an outer lead hole. A semiconductor chip mounting part and an outer lead part remain backed with the polyimide film 1. A slit 17 for bending use is formed in the vicinity of an outer lead 7. A semiconductor chip 10 is mounted in a semiconductor chip mounting part at the center of a pattern to interconnect a chip and an inner lead 8 with a gold wire 11. A film carrier is bent at the slit 17 so that a copper foil pattern comes to the exterior thereof. The polyimide films 1 piled up by bending are connected with each other with a bonding agent 15, and the bent part of a pattern is used as the outer lead 7 backed with the film 1. Thereby, the chip 10 comes on the front side of a device and the outer lead comes on the rear side of the device, so that LCC becomes equivalent. |
