| 摘要 |
<p>PURPOSE:To easily remove a scribe line close to a pattern, even if the pattern is present above it, by reducing the scribe line by the difference in width between its adjacent layers sequentially from the widest layer CONSTITUTION:A semiconductor chip is designed by CAD in such a manner that its border includes a multilayered scribe line having narrower upper layers and wider lower layers, and a pattern crosses the scribe line. In forming a scribe line 1, a predetermined pattern 2 is formed on it. The scribe line, close to the pattern, is reduced by the difference in width between its adjacent layers sequentially from the widest layer (a) according to the frame data expressed by the scribe line. As a result, the scribe line can be easily removed by giving various patterns to frame data.</p> |
