CONDUCTIVE PASTE, CERAMIC LAMINATION BODY, AND MANUFACTURE OF CERAMIC LAMINATION BODY

摘要

PURPOSE:To provide a ceramic lamination body in which delamination may not occur by manufacturing the ceramic lamination body by forming conductive paste including ceramic grain of a grain size larger than a film thickness of an inner conductor layer. CONSTITUTION:A process of forming an unbaked inner conductor layer comprising conductive paste including metal fine powder on a ceramic layer, and a process of laminating another ceramic layer on the inner conductor layer are repeated more than one times to form an unbaked ceramic lamination body. This unbaked ceramic lamination body is baked to provide a ceramic lamination body. In this manufacturing method, the conductive paste is formed to include ceramic grains of a larger grain size than a film tickness of the inner conductor layer after baking.