| 摘要 |
PURPOSE:To reduce the facility cost while enhancing the quality of products by coating the surface of an insulating board entirely with an insulating resin adhesive while covering a conductor pattern and temporarily drying the insulating board, and then laminating a copper foil having a previously roughened adhesive surface thereon through hot press rollers thereby shortening the time required for the lamination process. CONSTITUTION:An insulating substrate 1 is clad, on the opposite sides thereof, with a copper foil 2 to produce a copper clad laminate and then the surface thereof is subjected to mechanical surface treatment using a brush and chemical treatment, e.g. pickling. A circuit is formed of photoresist on the surface of the copper foil 2 which is then etched to form a conductor pattern 3 thus producing a both-sided printed wiring board. It is employed as an inner layer board and coated entirely, on the opposite sides thereof, with an insulating resin adhesive 4 while covering the conductor pattern 3 and then it is dried temporarily. A copper foil 5 having a roughened adhesive surface is applied to the surface of the adhesive 4 and passes through hot press rollers thus producing a four layer board. |
