| 摘要 |
PURPOSE:To form a resin-sealed part which has excellent moisture proofness and long-term high reliability with better production efficiency by preventing the residue of a bubble generated in cavity on the resin injecting gate side. CONSTITUTION:This is a molding device for resin-sealing use in which a lead frame 24 with a semiconductor element 23 mounted on is positioned, press- contacted and held by an upper mold 25 and a lower mold 25a. A molten resin S is injected to fill up a cavity 21 formed of the upper mold 25 and the lower mold 25a through a pressurized flow runner 26 and a resin injection gate 27 and the element 23 and the lead frame 24 are sealed with a resin in one end each. An air vent 29 for bubble discharging use is provided in at least area surface of the putting PL of the upper mold 25 or the lower mold 25a which is opposite to the position of a resin injecting gate 27 provided in the upper mold 25 or the lower mold 25a. |
